New BGAP520 PCIe NVMe product family addresses need for soldered-down and small module form factor Flash storage for industrial embedded market segments NEWARK, Calif., Dec. 08, 2020 (GLOBE NEWSWIRE) ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is ...

During electrical design process, certain design choices need to be made. One example is USB C type connector-based design with a straddle-mount connector. In such scenario, the overall PCB thickness ...

Intel’s BGA processors are definitely going to become a bigger part of Intel’s portfolio in the future and by the looks of things these BGA packages are mainly designed to transform the bottom segment ...

Designed for the STMicroelectronics 35-mm and 27-mm package sizes, the SG-BGA-6245 and SG-BGA-6246 sockets operate at bandwidths up to 8 GHz with less than 1-dB insertion loss. The sockets dissipate ...

Assuming position as one of the largest, full-pattern-capable, open-top sockets available, the 3M Textool brand Type IV, 0.8-mm, open-top BGA test and burn-in socket now accepts packages on a 0.8-mm ...

Types of lead-frame packages must also be considered since they normally do not incorporate return planes. If a lead-frame package is next to a BGA, a power supply return path needs to be designed ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...