A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
A new technical paper titled “A Thermal Machine Learning Solver For Chip Simulation” was published by researchers at Ansys. “Thermal analysis provides deeper insights into electronic chips’ behavior ...
Research, development, and production of novel materials depend heavily on the availability of fast and at the same time accurate simulation methods. Machine learning, in which artificial intelligence ...
A $1 million federal grant at the University of Iowa go towards increasing proficiency of UI engineering undergraduate and graduate students in the growing field of modeling and simulation and machine ...
Fabric might be the last thing on your mind when firefighters rescue someone from a burning building, but without fire-resistant clothing, such rescues might not happen at all. The turnout gear that ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback