Absolics says its facility can currently produce a maximum of 12,000 square meters of glass panels a year. That’s enough, Lee ...
Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have ...
In context: Manufacturers are trying to develop novel chip substrate technologies to save Moore's law and keep crunching the Megahertz rates up. Glass is the most promising material for next-gen ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
The big picture: Most expect that by the end of the decade, the semiconductor industry will hit a wall in terms of being able to scale transistors on silicon using organic materials. Scaling is key to ...
IBM Corp. is working with Amkor Technology, Advanced Semiconductor Engineering Inc., ASAT Holdings Ltd. and ASAT Inc. to develop advanced flip chip substrates and packaging. The companies each plan to ...
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