Cold soldering defects in a PV module. The problem has now become the most commonly found defect in pre-shipping module inspections. Image: CEA The electric grid is complex. For many generation ...

Previously, a Power Electronics Technology article titled “Inverted Acoustic System Cuts IGBT Failures” (September 2011) examined the use of an acoustic microscope to image heat-blocking defects such ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...