SPTS Technologies, a supplier of advanced wafer processing solutions, and imec, a world-leading nanoelectronics research center have announced a joint partnership to further advance micro- and ...
SPTS Technologies has announced its dry etch process technology for via reveal applications. Already established as the tool of record at major customer sites, the Pegasus Rapier module offers a ...
ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has ...
Via reveal, or post-TSV processing occurs after the through silicon vias (TSVs) are formed. The wafer is then temporarily bonded, face down, onto a carrier and ground typically to within 5-10 ...
Orbotech Ltd. (NASDAQ: ORBK) announced that it has successfully closed the previously-announced acquisition of SPTS Technologies Group Limited ("SPTS"), in a strategic move into the high growth areas ...
SPTS Technologies, a leading supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the receipt of a multi-system order from ...
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