Integra Technologies of El Segundo has brought out an RF power amplifier module/pallet designed to solve various size, weight, power, and cost challenges (SWaP-C) in high-performance L-band avionic ...
Geneva, October 15, 2020 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the acquisition and ...
Microchip Technology launched the SST11CP22, a 5 GHz power amplifier module (PAM) for the IEEE 802.11ac ultra high data rate Wi-Fi® standard. This PAM delivers 19 ...
The RMPA2455 RF power amplifier module operates in the 2.4 to 2.5-GHz frequency band. The device combines 30-dBm output power, 30-dB small-signal gain, and a 3 x 3-mm low-profile leadless package ...
LAS VEGAS--(BUSINESS WIRE)--April 5, 2006--At the CTIA Wireless 2006 conference, PulseWave RF(TM), Inc. (formerly PropheSi Technologies(TM), Inc.) today announced limited prototype sample availability ...
Combining high-impedance integrated power-amplifier (HIIPA) packaging with enhancement-mode (E-mode) gallium-arsenide (GaAs) wafer processing, Motorola's Semiconductor Products Sector has crafted a ...
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