Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to debut in early 2026.

As the demand for AI chips surges, and TSMC's capacity of CoWos is expected to remain tight until its Tongluo facility begins operation in 2027, other "CoWos-like suppliers" are expected to be thrust ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...