A semiconductor manufacturing company has little control over the system in which its parts are used. However, the system in which the IC is mounted is critical to overall device performance. For ...

Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

WILSONVILLE, Ore.--(BUSINESS WIRE)--Mentor Graphics Corporation (NASDAQ: MENT), the market and technology leader in printed circuit board (PCB) design solutions, today announced the technology ...

Mentor Graphics is bringing together the IC design, package design and PCB layout in a single tool environment. The design environment called Xpedition Package Integrator flow can be used to integrate ...

The complexity and density of electronics design has increased, partly due to the rise of the mobile industry, introducing new challenges for printed-circuit board (PCB) designers. Embedding ...

Embedded IC in package technology is a young and promising advanced packaging technique: understanding the status of the patent situation is key to understanding the business environment and ...

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...