iWave Systems has launched a solderable i.MX 8M Plus OSM (Open standard module) In OSM, SGeT defines a module to be soldered on the carrier board as an LGA package, rather than using edge or board to ...
Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...
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