Telit Wireless Solutions, Inc., an internationally leading specialist in machine-to-machine (M2M) technology, launches HE910, the worldwide smallest module featuring 5-band HSPA+. The module can thus ...
"Today marks the next chapter in our rich history of accelerating next generation technology adoption with leaders like Telit Cinterion," said Gautam Sheoran, Vice President and General Manager, ...
SHENZHEN, China--(BUSINESS WIRE)--Fibocom (Stock Code: 300638), a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, releases its latest 5G LGA ...
iWave Systems has launched a solderable i.MX 8M Plus OSM (Open standard module) In OSM, SGeT defines a module to be soldered on the carrier board as an LGA package, rather than using edge or board to ...
Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...
State-of-the-art Telit Cinterion FE990B34/40 LGA module family driven by the latest and greatest 3GPP Release 17 5G chipset High-power quad-core CPU delivers substantial processing power for customer ...
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