Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

Optical 3D metrology enables fast, non-contact surface roughness measurement of defects and roughness for precise ...

Optical surface defect inspection and imaging techniques are pivotal to ensuring high-performance outcomes across a myriad of applications including semiconductor manufacturing, precision optics, and ...

Eddy current testing is a well-established method of nondestructive testing that is used to examine nonferrous/nonmagnetic materials such as condenser and heat exchanger tubes in power generation ...

Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...

For a long time, semiconductor defect inspection focused on particles, and particle defects remain an important cause of yield loss. But as devices have become more complex, additional kinds of ...

MILPITAS, Calif., July 20, 2020 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced the revolutionary eSL10™ e-beam patterned-wafer defect inspection system. The new system is designed to ...

One of the biggest challenges for non-AI experts is the terminology. Artificial intelligence (AI), machine learning (ML), and computer vision (CV) are frequently discussed, but people outside of data ...

When a good die fails test and gets scrapped, often no one notices, because false failures look identical to real ones. Yet across the industry, these phantom defects are quietly eroding yield, ...

SAN FRANCISCO — A few weeks ago when Applied Materials announced that they were getting into the brightfield defect inspection biz, many saw it as a direct challenge to rival KLA-Tencor Corp. Wafer ...