Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...
When a good die fails test and gets scrapped, often no one notices, because false failures look identical to real ones. Yet across the industry, these phantom defects are quietly eroding yield, ...
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