The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the demand for higher performance in increasingly compact form factors [1]. Over ...

Flip chip packaging connects chips directly to boards using solder bumps, skipping the old wire bonding method for a more ...

Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...

A technical paper titled “Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin” was published by researchers at Delft University of Technology and NXP ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...

The standard addresses both wire-bond and flip-chip substrates, with clearly defined requirements across design, manufacturing, quality control, and reliability.

The issue of MEMS-based system solutions and their packaging will be addressed at the MEMS Industry Group’s annual MEMS Executive Congress, which will be held in Scottsdale AZ on November 3-5, 2010, ...

Japanese IC substrate manufacturer Shinko Electric Industries has announced that due to poor sales of its main product, flip chip packaging substrates, the upcoming fiscal report for the fiscal year ...

The most advanced makers of semiconductor packages use plasma to improve yield and reliability, especially when using advanced materials and package sizes decrease. Chip manufacturers rely on plasma ...