Part 4 of this series recognizes that, in spite of all efforts to keep the EMI and RFI from corrupting the sensor signals on their way from signal source to the signal conditioning instrumentation.

Designers rely on the accuracy of Process Design Kits (PDK¡¦s) for their IC designs. This paper describes independent verification of the PDK accuracy using a low-cost Die Level Process Monitor (DLPM) ...

Successful shield grounding cannot be divorced from the issue of good signal grounding; they go hand-in-hand. Thus both subjects will be treated as a combined topic in Part 2 of this series.