Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The ...

CHANDLER, Ariz. — In a move to keep pace with Taiwan competitors and ramp production of next-generation chip packages, Amkor Technology Inc. here has placed a major order for 200 leading-edge wire ...

The wire bonder equipment market is experiencing steady growth due to increasing demand from various industries such as electronics, telecommunications, and automotive. Companies are investing in ...