Renewable-energy applications, as well as all kinds of energy-efficiency technologies, require reliable, compact, and thermal-efficient power devices. For driving innovation in wind turbines, smart ...

The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and ...

3D sensing technology is rapidly being adopted in a variety of growing markets. End-product applications include smartphones, tablets, augmented/virtual reality products, robot vacuum cleaners, ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

The company’s plastic air-cavity package for next-generation RF power transistors replaces conventional ceramic, enabling higher gain and output with weight and bill-of-materials savings The company’s ...