At the IEEE International Electron Device Meeting (IEDM) 2022, Intel unveiled research breakthroughs in 2D and 3D IC packaging technologies fueling its innovation pipeline for keeping its promises to ...
Leading integrated circuit (IC) foundries are already shipping 7-nm and 5-nm wafers and 3-nm product qualifications are ongoing. Wafer costs continue to soar as high transistor density requires ever ...
Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services “We are pleased to collaborate with Cadence, a leader in electronic design software, ...
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